Item

Specifcation

Test Method

K

L

TCR

±100ppm/K

±200ppm/K

-55 ℃+125℃

Short-time Over-load

±0.5%R+0.05Ω

±0.5%R+0.05Ω

2.5 U R 或 2U R max 2s

Plating bond atrength of terminal

±0.5%R+0.05Ω

±0.5%R+0.05Ω

GB/T5729 4.33

IEC115-1

Resistance to Soldering heat

±0.5%R+0.05Ω

±0.5%R+0.05Ω

260 ±5℃ 10s

Thermal Shock

±0.5%R+0.05Ω

±0.5%R+0.05Ω

125 ℃ -55℃ 5次

5 CYCLES

Climatic Sequence

±3%R+0.1Ω

±3%R+0.1Ω

GB/T5729 4.23

IEC115-1

Damp-heat(Steady Seate)

±3%R+0.1Ω

±3%R+0.1Ω

GB/T5729 4.17

IEC115-1

Life

±3%R+0.05Ω

±3%R+0.1Ω

70 ℃ U R 100 h

Solder ability

Wet area shall be more than 95 ％

GB/T5729 4.17

IEC115-1

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

100

102

105

107

110

113

115

118

121

124

127

130

133

137

140

143

147

150

154

158

162

165

169

174

178

182

187

191

196

200

205

210

215

221

226

232

237

243

249

255

261

267

274

280

287

294

301

309

316

324

332

340

348

357

365

374

383

392

402

412

422

432

442

453

464

475

487

499

511

523

536

549

562

576

590

604

619

634

649

665

681

698

715

732

750

768

787

806

825

845